Pack Expo International
何时: Sunday, October 31, 2010 - Wednesday, November 3, 2010
何地: McCormick Place, Chicago, Illinois, USA
描述: Intermec will join 45,000 industry leaders in Chicago this October. Attendees at this event will find the full array of packaging and processing innovations and take home the technologies you need to improve operations, increase efficiency, reduce recalls, maintain equipment and protect your brand—total system solutions at one powerful show. Intermec booth #E6037 will showase rugged mobile business solutions featuring fixed and mobile printers, mobile computers and labelling solutions.
目标行业: Industrial, Consumer Goods, Transportation, Logistics, Retail
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